BOS Semiconductors, a fabless semiconductor company specializing in automotive and Physical AI solutions, is showcasing its AI Box demo at CES 2026, the world’s largest technology exhibition, taking place in Las Vegas from January 6 to 9, 2026. The company is exhibiting at the Venetian Expo, Hall A, Booth #50017.
At CES 2026, BOS Semiconductors is presenting its AI Box, a solution designed for next-generation mobility. According to the company, the AI Box enables automotive original equipment manufacturers (OEMs) to add an “AI brain” to vehicles without replacing existing in-vehicle infotainment (IVI) systems. This approach has recently gained significant attention within the automotive industry.
During the exhibition, BOS highlights its strategy aligned with major industry trends, including autonomous driving, the transition toward Software Defined Vehicles (SDVs), and the expansion of Physical AI. Through live demonstrations, the company shows support for a wide range of AI models based on CNN and Transformer architectures, flexible scalability and integration with existing automotive electronic systems, as well as real-time perception and decision-making enabled by Physical AI.
The AI Box is an external AI computing module powered by the high-performance Eagle-N AI accelerator, allowing rapid expansion of AI capabilities with minimal changes to existing vehicle platforms. According to BOS, this enables faster adoption of advanced AI functions not only in new vehicles but also in updated versions of existing models, reducing development time and costs.
Built on an on-device AI architecture, the AI Box processes sensitive data such as voice and video directly inside the vehicle rather than in the cloud, strengthening privacy and data security. The architecture also ensures stable AI operation regardless of network connectivity and helps reduce total cost of ownership (TCO) by lowering cloud-related inference and storage costs.
The AI Box is designed to integrate flexibly with existing vehicle systems through multiple interfaces. At CES 2026, BOS demonstrates on-device AI models combining Vision-Language Models (VLMs) and Large Language Models (LLMs) based on the AI Box architecture. These demonstrations are presented at the company’s booth at the Venetian Expo and also at the Tenstorrent Demo Room.
Through its CES 2026 showcase, BOS Semiconductors presents a practical approach to scaling Physical AI capabilities in vehicles without replacing existing in-vehicle platforms.